Wirebonder
We have an ultrasonic wedge bonder (West Bond 7476E Wedge), designed to interconnect micron-scale wire leads between chip carriers and devices. The machine can bond aluminum or gold wires of ranging diameter (typically 25 um).
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We have an ultrasonic wedge bonder (West Bond 7476E Wedge), designed to interconnect micron-scale wire leads between chip carriers and devices. The machine can bond aluminum or gold wires of ranging diameter (typically 25 um).