Thin Film Deposition Laboratory

We have a dual-chamber magnetron sputtering tool with DC and RF deposition capabilities. The chambers are dedicated to metal and oxide deposition, respectively, with a separate load lock. We can deposit from two different targets simultaneously (co-deposition) in both chambers, and they can operate independently.

Currently, the two chambers accommodate twelve targets (7 DC and 5 RF) with a possibility of an upgrade up to seventeen. The oxide chamber has a gun for off-axis deposition, a unique feature to deposit stoichiometric films from multi-element targets. Reactive gases are also available (O₂ and N₂). The sample holder can rotate, be heated (up to 850°C), and apply a transverse magnetic field of 20 mT on the substrate during the deposition. Both chambers work at a base pressure in the range of 5x10^8 Torr.